High-Precision Micro Assembly Station | Semiconductor Packaging
United Spectrum Company is proud to offer the world’s best customized systems for high-precision micro assembly and micro production technology to our clients in India. Automated and high-throughput silicon photonic packaging solutions in India.
Nano Place: High-Precision Micro Assembly Station With Epoxy Gluing or Laser Soldering.Opto-Electronic Device Packaging Solution.
High-Precision Micro Assembly Station | Semiconductor Packaging
The High-Precision Micro Assembly Station With Epoxy Gluing or Laser Soldering Systems are made in Germany by Nanosystec Gmbh, which is superior in quality and good support. We are the leading supplier of high precision, high quality, highly reliable micro assembly & micro production for opto-electronics IC packaging, Photonics Integrated Circuits (PIC’s) industries in India. We also offer Epoxy gluing, pick and place, laser welding and optical/electrical testing systems. NanoPlace is a pick-and-place solution for manufacturing electro-optical subassemblies. The inherent precision allows positioning of diode laser, lenses, arrays, photo detectors and other optical elements with an error of less than 1µm. The fully automated assembly station NanoPlace covers a work area of 200 mm x 200 mm (other dimensions on request). It takes components, such as lenses or dies from a loading area and mounts them onto carrier devices. The assembly methods include epoxy gluing with UV or thermal curing as well as laser soldering.
We offer the best Photonics Packaging system solution for Optical Communication Components. World’s Best High-Precision Micro Assembly Station With Epoxy Gluing or Laser Soldering System in India
-  • Advanced Technology
-  • High Quality
-  • High Reliable
-  • Good Support
-  • Made in Germany
High-precision station
Medium volume at reasonable price
Pick-up with 360° capability
Repeatable positioning
Motorized zoom
Lens with factor 12.5
ED illumination in various colours
Precision Assembly for Medium Volume
Repeatable Positioning
Pick-Up with 360° Capability
Gripping with Optional Force Detection
Powerful Machine Vision Capability
Motorized Zoom Function
Adjustable Illumination in various Colours
Epoxy Gluing or Laser Soldering Capability
Process Software
Process Monitoring
Remote Access
Laser Soldering for Silicon Photonics PackagingÂ
Laser Soldering for Opto electronics Packaging
Laser Soldering for Photonic Integrated Circuits
Laser Soldering for TOSA, ROSA, QSFP, BOSA, TO, Butterfly type product packaging.
Laser Soldering for Transmitter Optical Sub Assembly (TOSA) packaging
Laser Soldering for Receiver Optical Sub Assembly (ROSA) packaging
Laser Soldering for Bi-Directional Optical Sub Assembly (BOSA) packaging
Laser Soldering for Integrated Photonic Devices
- Automated Fiber-Optics Assembly
Photonics Automated Assembly & Testing
Electro-optical Device Testing
Photonic device assembly (align-&-attach)
Electro-optical testing (test-&-qualify)
Automated Photonics Assembly
Photonic Device Assembly
Photonic Device Testing
Automated Photonics Probing
Optional Accessories
Multiple device trays and stop-motion conveyor belts increase the throughput and allow for the integration into fully automated production lines.
Cameras mounted to the focusing lenses of the laser processing optics support the image data processing during laser soldering and laser welding. In addition, machine vision monitors the dispensing of resin or solder paste.
Various assembly techniques can be combined in one station, such as laser welding, laser soldering and epoxy gluing. Exchangeable device trays allow for the versatile micro assembly in various batch.
Different tooling can be changed during the process without operator intervention.
Information
- Automated Fiber-Optics Assembly
Photonics Automated Assembly & Testing
Electro-optical Device Testing
Photonic device assembly (align-&-attach)
Electro-optical testing (test-&-qualify)
Automated Photonics Assembly
Photonic Device Assembly
Photonic Device Testing
Automated Photonics Probing
Enquiry
For Micro Assembly Station With Epoxy Gluing or Laser Soldering enquiry and to discuss more about your application requirement, with one of our laser engineer. To know Micro Assembly Station With Epoxy Gluing or Laser Soldering machine price, Please call us direct on +91 9789904948 or vsit our regional office or complete the request form and we will contact you, as soon as possible. We United Spectrum company also offer the best quality laser marking, laser cutting, laser texturing, laser engraving, laser cleaning, laser welding, laser cladding, laser hardening, laser shock peening, laser micro machines in India. We offer Advanced Packaging Solutions For Semiconductor Industry in India.
