Hybrid Laser Micro Machining System

Hybrid Laser Micro Machining System

    Roll to Roll Laser Micro Machine for Processing of Flexible Substrates

We United Spectrum  company offer the best quality laser micro cutting, laser micro drilling, Laser 3D Micro Milling, Laser Scribing, Laser Ablation, Laser Patterning, Laser Etching, Hybrid Laser Micro Machining System in India. United Spectrum company is the official distributor of M-Solv Ltd. (UK) company products for Indian market.

Hybrid Laser Micro Machining System

 The roll-to-roll laser machine is suitable for highly scalable manufacturing process and all-in-one approach for photovoltaics, appliances , medical equipment, screens and semiconductors for the manufacture of lightweight thin films. It integrates high-precision laser manufacturing with technology for cleaning, coating, patterning, and packaging and inline quality management. Various tailored applications are possible due to its modular concept, spanning from large mass manufacturing to pilot lines and advanced science.

Making of precision micro holes and printing electrodes for medical electronic components with laser drilling and  subsequent spray & inkjet techniques are essential for medical device manufacturing industries.Our M-Solv Laser workstations convert modular flexible electronic circuits into both roll-to-roll and sheet-to-sheet formats. The laser system has high resolution vision system to locate print registration marks and for precise laser cut. This Laser system is designed, with the results in a compact footprint with very high printing precision, with optional UV cure (Hg lamp or LED) for nanoparticulate metal inks, etch resistors, dielectrics, etc., It has a computer vision camera for layer-to-layer alignment like vacuum chuck rotation that secures the workpiece over ±1o

 

The model MSV 2508 ITO and thin film patterning tool is a high-specification production tool for step-and-scan thin film and ITO ablation or other laser patterning requirements for example on both sides of a flat panel display panel. This unique (patent pending) approach optimizes processing speed while minimizing footprint. Originally aimed at hand held flat panel display applications the tool can be used for a variety of ITO removal applications for Display and thin film photovoltaic applications.

World’s Best High Precision Hybrid Laser Micro Machining System in India

  •  • Advanced Technology
  •  • High Quality
  •  • High Reliable
  •  • Good Support
  •  • Made in U.K
  • Laser Ablation of thin-film layers for sensors
  • Manufacturing of printed organic solar cells
  • P1, P2, P3, PT structuring of flexible solar cells
  • High throughput
  • Dual board processing
  • Simultaneous dual sided and dual pattern processing
  • Automated robotic board loading
  • As thin as 10µm trench width
  • Scan field up to 50mm x 100mm
  • Dual UV 355nm lasers
  • Dynamic focus compensation
  • Dynamic focal spot size control
  • Dynamic laser power control
  • Class 1 laser safe enclosure
  • Touch panel operation
  • Ultra stable granite construction
  • Vibration isolated machine core
  • Nano-Particle Solutions
  • Nano-Wire Solutions
  • Battery Materials
  • Conductive Films
  • Overcoat Materials
  • Nano-Particle Metal Inks
  • Nano-Particle Inks
  • Etch Resists
  • Overcoats
  • Graphene NP Ink
  • Organic Semiconductors
  • Direct Write Ablative Patterning
  • Scanned Mask Imaging
  • Laser Sintering
  • Laser Cutting
  • Laser Drilling
  • Photo-Curing

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Enquiry

For Hybrid Laser Micro Machining System enquiry and to discuss more about your application requirement, with one of our laser engineer. To know Hybrid Laser Micro Machine price,  Please call us direct on +91 9789904948 or visit our regional office or complete the request form and we will contact you, as soon as possible. We United Spectrum company also offer the best quality laser marking, laser cutting, laser texturing, laser engraving, laser cleaning, laser welding, laser cladding, laser hardening, laser shock peening, laser micro machines in India.

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