What is the NanoTest SiP-Wafer and what does it measure?

The NanoTest SiP-Wafer is a specialised characterisation system designed for wafer-level testing of silicon photonics (SiP) devices. It combines optical probing, electrical testing, and precision alignment to validate device performance directly on wafers before dicing and packaging. With sub-micron positioning accuracy, advanced vision systems, and automated workflows, the system ensures fast, reliable, and repeatable results. Supporting comprehensive measurements such as insertion loss, coupling efficiency, IV curves, and high-speed electrical testing, the NanoTest SiP-Wafer accelerates R&D and production workflows. Its modular design makes it equally suitable for research institutions, semiconductor fabs, and photonic device manufacturers.

What is wafer-level characterisation and why is it different from chip-level testing?

Wafer-level characterisation tests photonic devices while they are still part of the intact silicon wafer — before the wafer is diced into individual chips and before any packaging, wire-bonding, or module assembly takes place. This is fundamentally different from chip-level testing, which characterises individually diced and often packaged devices. Wafer-level testing accesses devices through on-wafer optical coupling structures — typically grating couplers that allow vertical coupling of light from a fibre positioned above the wafer surface — and on-wafer electrical probe pads, without the need for chip-level optical fibre attachment or wire bonding. Because the entire wafer map can be tested before any dicing decisions are made, wafer-level characterisation provides a complete picture of process variation across the wafer, enables die-level bin sorting based on measured performance, and generates the process monitoring data required for statistical process control in silicon photonic manufacturing.

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Dedicated Wafer-Level Testing for Silicon Photonics Up to 12 Inches

The NanoTest SiP-Wafer is purpose-engineered for wafer-level characterisation of silicon photonic devices on wafers up to 12 inches — the standard wafer format for high-volume silicon photonics manufacturing on CMOS-compatible 300 mm fabs. This 12-inch capability ensures that the NanoTest SiP-Wafer is compatible with both current silicon photonics production wafer sizes and the industry trajectory toward larger-format silicon photonic wafer manufacturing. The system’s wafer handling and alignment architecture accommodates the full wafer map without sample repositioning, enabling automated die-to-die characterisation across the complete wafer area within a single measurement session.

Sub-Micron Automated Active Alignment

Achieves sub-micron positioning precision using linear encoders and motorised stages with automated active alignment — finding and holding the optimum optical coupling position at each test site using real-time optical power feedback. Sub-micron alignment is essential for silicon photonic grating coupler measurement, where coupling efficiency is a strong function of fibre position over the coupler aperture and angular alignment relative to the coupler grating direction. Consistent, automated sub-micron alignment at every die position across the wafer map eliminates the coupling-position variability that would otherwise introduce site-to-site measurement uncertainty, ensuring that measured insertion loss and coupling efficiency data genuinely reflect device performance variation rather than measurement positioning artefacts.

Comprehensive Optical and Electrical Test Suite

Performs optical insertion loss measurement, coupling efficiency characterisation, spectral transmission sweeps, group delay measurement, polarisation-dependent loss, and thermal stability testing — combined with electrical IV curve measurement, leakage current characterisation, electro-optic modulator drive voltage measurement, photodetector responsivity, and high-speed electrical testing for active silicon photonic devices. This combined test suite covers the complete characterisation requirement for silicon photonic passive structures (waveguides, rings, AWGs, splitters), active devices (modulators, photodetectors, heaters), and integrated circuits containing both passive and active elements — within a single automated measurement sequence applied at wafer level before dicing.

Temperature-Controlled Chuck from -20°C to +100°C with Nitrogen Purge

The temperature-controlled wafer chuck operates from -20°C to +100°C, covering sub-ambient testing for cryogenic-adjacent silicon photonic device characterisation, ambient characterisation, and elevated temperature testing for devices specified across industrial or automotive temperature ranges. Fast thermal response allows temperature sweeps to be executed within automated measurement sequences at production-compatible cycle times. The nitrogen purge option prevents condensation on the wafer surface and optical probe hardware during sub-ambient testing, enabling reliable below-ambient measurements without moisture-related measurement artefacts or risk of surface contamination on sensitive silicon photonic wafers.

OptoSpin Module for High-Throughput Production Testing

The OptoSpin module adds automated wafer handling, high-speed die-to-die navigation, and production-rate measurement sequencing to the NanoTest SiP-Wafer platform — transforming the system from a precise R&D characterisation tool into a high-throughput production wafer test station capable of characterising complete wafer lots at semiconductor manufacturing throughput rates. With the OptoSpin module, the system automatically loads wafers, navigates between test sites, executes measurement sequences, logs results, and generates wafer maps without operator intervention between die measurements. This automation capability is the key enabler for using wafer-level SiP characterisation as a standard production step — rather than a selective sampling measurement — in high-volume silicon photonics manufacturing.

Single-Mode Fibre and Fibre Array Optical Probing

Supports optical probing using both individual single-mode fibres — for single-port grating coupler or edge-facet coupling — and fibre arrays for simultaneous multi-port optical access to devices with multiple input/output waveguide channels. Fibre array probing significantly increases measurement throughput for multi-port silicon photonic devices such as arrayed waveguide gratings, optical switches, and multi-channel photonic circuits — allowing all ports to be accessed simultaneously rather than sequentially. The system’s fibre probe positioning stages accommodate both single fibre and array configurations with the same sub-micron alignment performance, ensuring that multi-port measurement results are not compromised by differential coupling efficiency variation between array channels.

Machine Vision Inspection and Automated Die Navigation

Integrated machine vision provides automated wafer die recognition, fiducial-based position correction, grating coupler pattern detection for optical probe alignment guidance, and post-measurement visual inspection within the characterisation workflow. The vision system enables automated navigation between die positions across the full wafer map — identifying the correct measurement site at each position using pattern recognition rather than requiring manual visual identification — and provides defect detection capability for mechanical damage, surface contamination, and process-induced visual defects that would be flagged for exclusion from optical measurement. Vision data for each die position is captured and logged alongside electrical and optical measurement data, providing complete wafer map traceability.

Scalable from R&D Through Semiconductor Volume Production

The NanoTest SiP-Wafer serves the complete silicon photonics development and manufacturing workflow — from early-stage R&D characterisation of prototype wafers through pilot line process development and into volume production test. In R&D and pilot line use, the system’s flexibility and comprehensive measurement capability enable detailed process characterisation and device performance mapping across full wafer lots. In volume production, the OptoSpin module and recipe-driven automation deliver the throughput and consistency required for semiconductor-scale manufacturing. The same platform, the same test recipes, and the same measurement data format serve all stages — providing continuous data traceability from R&D through production and enabling direct correlation of production yield data with process development measurements.

Photonics and Optical Communications

Validates silicon photonics wafers for DWDM transceivers, coherent optical communication modules, wavelength multiplexing devices, and integrated optical switching fabrics used in data centre and telecom network infrastructure. Silicon photonic transceiver wafer characterisation requires systematic measurement of ring resonator insertion loss and resonance wavelength uniformity across the wafer, Mach-Zehnder modulator extinction ratio and Vpi, germanium photodetector responsivity and dark current, and grating coupler coupling efficiency — all of which the NanoTest SiP-Wafer delivers within automated wafer map measurement sequences. Applied at silicon photonics foundry customers qualifying wafer lots before dicing, and at transceiver OEMs characterising SiP wafers received from external foundries.

Semiconductor and Microelectronics Manufacturing

Supports wafer-level testing of silicon photonic integrated circuits and hybrid photonic-electronic chips in semiconductor fabs and photonic device manufacturing facilities, enabling high-volume manufacturing with reduced defect escape rates and improved process yield. In semiconductor manufacturing environments, the NanoTest SiP-Wafer functions as a dedicated photonic test station — analogous to a parametric electrical test station for standard CMOS wafers — providing per-die optical and electro-optical characterisation data that feeds into wafer-level bin-sorting, yield analysis, and statistical process control programmes. The system’s 12-inch wafer capability and OptoSpin-enabled throughput make it compatible with production-scale silicon photonics manufacturing on standard 300 mm CMOS-compatible fabs.

Data Centres and Cloud Infrastructure

Ensures that silicon photonic transceivers, co-packaged optics devices, and wavelength-division multiplexed interconnect chips meet the bandwidth, insertion loss, power efficiency, and thermal stability requirements for hyperscale data centre networks at 400G, 800G, and beyond. Data centre silicon photonics supply chains demand wafer-level qualification at the component supplier, with performance verification data traceable to individual wafer lots and die positions. The NanoTest SiP-Wafer’s comprehensive measurement capability and automated wafer mapping provide the data quality and traceability required for silicon photonic component qualification in hyperscale data centre procurement programmes.

Aerospace and Defence

Applied in wafer-level testing of silicon photonic devices for satellite optical communication terminals, secure fibre-optic network modules, integrated photonic sensing chips, and quantum photonic circuit characterisation for defence applications. Aerospace and defence silicon photonic qualification requires characterisation over an extended temperature range, measurement traceability to calibration standards, and documentation compatible with aerospace quality management frameworks. The NanoTest SiP-Wafer’s wide chuck temperature range, comprehensive measurement logging, and TestMaster recipe management support the structured, traceable characterisation programmes required for aerospace and defence photonic device qualification at DRDO, ISRO, BEL, and their supply chains in India.

Research and Development

Universities, national photonics research institutes, and corporate silicon photonics R&D groups use the NanoTest SiP-Wafer to characterise prototype SiP wafers, validate new device designs, measure fabrication process performance, and accelerate the development cycle from foundry run to design iteration. Wafer-level characterisation with the NanoTest SiP-Wafer enables researchers to generate complete wafer maps of key performance parameters — waveguide propagation loss, ring resonator Q-factor distribution, modulator bandwidth uniformity, photodetector responsivity variation — that provide direct, quantitative feedback on fabrication process quality and device design sensitivity. Applied at IIT and NIT silicon photonics research groups, C-DOT integrated photonics programmes, and corporate photonics R&D centres across India accessing silicon photonics foundry services in Europe, the US, and Asia.

Industrial Laser Systems

Supports wafer-level validation of silicon photonic chips integrated with on-chip laser sources, wavelength-selective feedback structures, and photonic integrated circuit elements for laser beam combining and spectral control in advanced industrial laser systems. SiP wafer characterisation for industrial laser applications requires measurement of on-chip waveguide coupling efficiency, spectral filter performance, and electro-optic modulation characteristics — all within the automated wafer-level measurement workflow that the NanoTest SiP-Wafer provides, enabling systematic characterisation of SiP chips destined for integration into laser diode driver and beam management systems.

Medical Devices and Biophotonics

Applied in wafer-level characterisation of silicon photonic chips for point-of-care diagnostic platforms, lab-on-chip microfluidic sensing systems, integrated photonic biosensors, and optical coherence tomography signal processing circuits. Medical SiP wafer characterisation requires measurement precision sufficient to verify compliance with clinical device performance specifications and the process documentation standards of ISO 13485 medical device quality management. The NanoTest SiP-Wafer’s comprehensive measurement capability, automated data logging, and TestMaster recipe management provide the characterisation infrastructure for medical-grade SiP wafer qualification, supporting the growing use of silicon photonics in point-of-care diagnostics and implantable biosensor development.

Automotive and EV Industry

Used for wafer-level validation of silicon photonic integrated circuits for solid-state LiDAR transmitter chips, optical sensor arrays in ADAS perception systems, and photonic integrated circuits for in-vehicle optical network applications. Automotive silicon photonic wafer qualification requires characterisation across the AEC-Q102 temperature range — with the NanoTest SiP-Wafer’s -20°C to +100°C chuck temperature range covering the core of the automotive operating temperature specification — combined with measurement documentation compatible with IATF 16949 automotive quality management systems. The system’s automated measurement sequences and complete data logging provide the structured, repeatable qualification data required for automotive silicon photonic component approval programmes at Tier-1 and Tier-2 automotive suppliers.

United Spectrum Instruments is the authorised distributor of Nanosystec’s NanoTest SiP-Wafer Silicon Photonics Characterisation System in India, delivering advanced wafer-level photonic test solutions with comprehensive local technical support. We support customers from initial application evaluation and wafer format assessment through to system installation, measurement workflow development, operator training, and long-term after-sales service.

Genuine NanoTest SiP-Wafer Systems with Manufacturer Warranty and Dedicated Local Support

Every NanoTest SiP-Wafer system supplied by United Spectrum Instruments is a genuine Nanosystec GmbH product backed by manufacturer warranty and supported locally by our silicon photonics characterisation engineers. We coordinate directly with Nanosystec for application-specific configuration — including fibre probe and array selection, chuck temperature specification, OptoSpin module integration, and TestMaster measurement workflow development — ensuring the system delivered is correctly matched to your wafer format, device type, and characterisation programme requirements.

• Silicon Photonics Characterisation Expertise — our engineers bring direct knowledge of SiP wafer measurement methodology, grating coupler coupling optimisation, ring resonator characterisation, electro-optic device testing, and TestMaster automation development for silicon photonics applications, enabling meaningful technical consultation on measurement strategy and workflow design for your specific device types.
• Pan-India Installation, Measurement Workflow Development, and Training — United Spectrum Instruments provides on-site installation, TestMaster measurement sequence development for your SiP device types, and comprehensive operator training at customer facilities across India, with follow-up measurement support to ensure accurate and productive NanoTest SiP-Wafer deployment from the first wafer run.
• Wafer Format and Application Consultation — we provide pre-purchase wafer size and device type review, coupling geometry assessment (grating vs edge facet), fibre probe configuration guidance, temperature range specification, and OptoSpin throughput estimation to ensure the NanoTest SiP-Wafer configuration selected correctly supports your wafer format, measurement requirements, and throughput targets.