Smart Ultrafast Femtosecond Laser Micro Milling System

The GL.smart Smart Ultrafast Femtosecond Laser Micro Milling System from GFH GmbH is a compact, all-in-one ultrafast laser micromachining platform integrating...

Home>

Smart Ultrafast Femtosecond Laser Micro Milling System

1024x640
Smart ultrafast femtosecond laser micro machining system
High precision laser stent cut
Micro laser drilling tool steel
Micro laser cutting center hole clock gear
Laser turning carbide sample part
Laser turning carbide embossing insert
Fine cutting steel edge

Discover GL.smart – a compact, high-precision Micro Milling System for drilling, turning, and cutting

The GL.smart Smart Ultrafast Femtosecond Laser Micro Milling System from GFH GmbH is a compact, all-in-one ultrafast laser micromachining platform integrating laser drilling, laser turning, and laser cutting with up to 5-axis simultaneous motion (X/Y/Z + B/C rotary), a natural granite base for vibration-free stability, direct-drive motors with linear encoders, femtosecond and picosecond USP laser compatibility, workpiece capacity up to 100 mm diameter, Class 1000 cleanroom readiness, Industry 4.0 data logging and diagnostics, robotic handling and vision alignment options, and five named hardware modules — GL.beam for fixed-beam stability, GL.trepan for dynamic trepanning, GL.optifix for fixed optics, GL.scan for galvo scanning, and GL.rotil for rotary laser turning — delivering 10 µm minimum feature size for medical stents, watchmaking components, wafer dicing, turbine cooling holes, MEMS, and precision micro-tooling — available in India exclusively through United Spectrum Instruments, official GFH GmbH distributor.

What Makes GL.smart the Right Choice Over the GL.compact and Multi-Axis Platform?

GFH GmbH offers three precision laser micromachining platforms through United Spectrum Instruments in India, each optimised for a different primary use case. The GL.compact prioritises compact footprint — delivering sub-6 µm accuracy in a 3-tonne, 1400 × 2600 mm space-saving package for environments where floor space is the primary constraint. The Multi-Axis Platform prioritises ultimate accuracy — achieving 1.5 µm / 1 µm positioning accuracy and repeatability in a 3700 kg platform for applications where single-micrometre tolerances are essential. The GL.smart is positioned as the most process-versatile and automation-ready of the three — its defining characteristics are the integration of laser drilling, laser turning, and laser cutting in one platform with the named modular hardware system (GL.beam, GL.trepan, GL.optifix, GL.scan, GL.rotil) that allows the beam delivery configuration to be precisely matched to each process type, combined with Industry 4.0 connectivity, robotic handling options, and workpiece capacity up to 100 mm diameter. For manufacturers who need to perform all three core laser micromachining processes on the same production shift — drilling stents, turning micro-shafts, and cutting gear profiles — and who need the automation connectivity of a smart manufacturing environment, the GL.smart is the correct platform.

Key performance fact:

The GL.smart’s defining capability is the combination of three laser micromachining processes — drilling, turning, and cutting — with five interchangeable hardware modules and five-axis simultaneous CNC motion (X, Y, Z, B, C) in a single compact platform with Class 1000 cleanroom readiness and Industry 4.0 connectivity. This process integration eliminates the need for three separate laser machines, three separate workpiece setups, and three separate quality inspections for components requiring all three processes — reducing setup time, eliminating inter-machine handling risk, and enabling complete micro-component fabrication on one platform at one workstation within one production workflow.

What is the GL.smart and what processes does it perform?

In precision manufacturing, the demand for highly flexible, compact, and ultra-precise machining platforms has never been greater. The GL.smart from GFH GmbH meets these needs by integrating laser drilling, laser turning, and laser cutting in one modular platform, empowering manufacturers across the medical, aerospace, electronics, and watchmaking industries. Now available in India through United Spectrum Instruments, the GL.smart system delivers unmatched performance in micro-feature fabrication, driven by a suite of powerful hardware modules including GL.beam for fixed-beam stable laser processing, GL.trepan for trepanning optics enabling dynamic beam shaping, GL.optifix for fixed optics configurations, GL.scan for galvanometer-based laser scanning, and GL.rotil for rotary axis machining and laser turning.

 

What is laser turning and how does the GL.rotil module enable it?

Laser turning is a non-contact subtractive machining process in which a rotating workpiece has material removed from its cylindrical surface by a focused laser beam — the laser beam plays the role of the cutting tool in conventional lathe turning, but without mechanical contact, tool wear, or the cutting forces that deform or damage delicate micro-components. As the workpiece rotates about its axis (the C-axis in the GL.smart’s 5-axis configuration), the laser beam is precisely positioned at the workpiece surface and the combination of workpiece rotation and laser beam Z-axis traverse removes material to define the desired cylindrical or complex radial profile. The GL.rotil module adds the dedicated rotary axis and synchronised motion control needed for laser turning — allowing the GL.smart to produce miniature shafts, pins, needles, and rotationally symmetric components directly from rod stock without a mechanical lathe. For watchmaking micro-axles and pinions, medical cannula bevels, and precision micro-tooling cylindrical features, laser turning on the GL.smart achieves the combination of surface quality and dimensional accuracy that is impossible with mechanical turning at these sub-millimetre part diameters.

Feature Details
Machine Base Natural granite for vibration-free stability
Drive System Direct-drive motors with linear encoders
Motion Control Axes Up to 5-axis simultaneous movement (X/Y/Z + B/C rotation)
Laser Types Supported Femtosecond and Picosecond USP Lasers
Workpiece Size Up to 100 mm in diameter
Automation Options Robotic handling, vision alignment, and inline monitoring
Control Interface Intuitive GUI with integrated diagnostics
Cleanroom Compatibility Class 1000 ready

Three Processes in One Compact Platform: Drilling, Turning, and Cutting

The GL.smart integrates laser drilling, laser turning (via the GL.rotil rotary axis module), and laser cutting in a single compact platform — eliminating the need for three separate laser machines and the inter-machine workpiece handling that introduces contamination risk, registration errors, and production floor complexity. For precision micro-component manufacturers whose products require all three processes — a micro-surgical tool that requires hole drilling, shaft turning, and profile cutting in a single part, for example — the GL.smart’s process integration reduces total machining cycle time, eliminates inter-machine setup overhead, and ensures that all three operations are performed with consistent sub-10 µm accuracy within one workholding setup.

Five Modular Hardware Modules for Application-Specific Beam Delivery

Five named hardware modules allow the beam delivery configuration to be precisely matched to each process and application: GL.beam provides a fixed beam path for maximum stability in precision marking, glass cutting, and surface modification applications requiring pinpoint consistency; GL.trepan provides trepanning optics for circular and helical beam motion essential for high-quality hole drilling at programmable diameters; GL.optifix provides versatile fixed optics for stable focal positioning across flat and slightly contoured surfaces; GL.scan integrates galvanometer-based scanning for rapid, large-area processing including fast marking, surface texturing, and high-resolution structuring; and GL.rotil adds the rotary axis and synchronised motion control for laser turning of cylindrical micro-components. The ability to configure these modules at purchase — and to reconfigure or add modules as application requirements evolve — gives the GL.smart a process flexibility range that no single-mode beam delivery system can match.

Ultra-Short Pulse Femtosecond and Picosecond Laser for Cold Ablation

Full compatibility with USP femtosecond and picosecond laser sources enables cold ablation across all materials and all three process modes — drilling, turning, and cutting — with virtually no heat-affected zone, no recast layer, and no microcracking. Cold ablation is the enabling requirement for the feature quality specifications of the GL.smart’s target applications: stent strut edge quality (no recast layer that would initiate fatigue fracture), cannula bevel surface roughness (no thermal oxidation that would affect biocompatibility), watch gear tooth profile (no HAZ that would alter the hardened surface layer defining tribological performance), and wafer dicing street quality (no HAZ-induced dislocation generation that would degrade die electrical performance). USP cold ablation across all three process modes is what makes the GL.smart applicable to these demanding applications.

Natural Granite Base for Vibration-Free Ultra-Precise Processing

The natural granite machine base provides inherent vibration damping and thermal stability — the mechanical foundation required for consistent micron-level accuracy across production shifts and environmental temperature variation. Granite’s high internal damping attenuates floor vibration transmission more effectively than steel or cast iron per unit mass, and its low, uniform thermal expansion coefficient minimises the dimensional changes caused by thermal gradients from laser heating, motor warming, and ambient temperature cycling that would otherwise cause accuracy drift. The granite base is the common precision foundation shared across the GFH GmbH platform range — including GL.compact and the Multi-Axis Platform — and it is what allows the GL.smart to deliver consistent 10 µm feature capability across the full production shift without thermal re-calibration.

5-Axis Simultaneous Motion Including B and C Rotary Axes

Up to 5-axis simultaneous motion — X, Y, Z linear axes plus B (tilt) and C (rotation) rotary axes — enables processing of complex 3D geometries, cylindrical components, curved surfaces, and multi-sided parts through synchronised multi-axis interpolation. The B and C rotary axes are the enabling addition for laser turning (continuous C-axis rotation with X-Z linear traverse for cylindrical profiling), angled hole drilling (simultaneous B and C tilting with X-Y-Z positioning for drilling at defined angles to curved surfaces), and complex 3D surface structuring where the workpiece must be continuously reoriented relative to the laser beam to maintain surface-normal incidence. Five-axis simultaneous interpolation on the GL.smart enables single-setup complete machining of complex parts that would require multiple fixturings on a 3-axis system.

Medical and Life Sciences

The medical industry demands ultra-clean, burr-free, and biocompatible processing methods — all of which GL.smart delivers through USP cold ablation and micron-level precision. Fabrication of cardiovascular micro-stents in nitinol and stainless steel with consistent strut widths, hole diameters for drug elution, and burr-free edges that meet ISO 13485 quality requirements; cannula and hypodermic needle tip shaping with fine bevels and smooth finishes using the GL.rotil laser turning capability; bone screw and orthopaedic implant micro-thread definition and surface texture structuring for improved osseointegration; and microfluidic channel fabrication in polymers and glass without burrs, charring, or thermal damage to the channel walls. The GL.smart’s Class 1000 cleanroom compatibility and Industry 4.0 process data logging directly support the ISO 13485 process validation and traceability requirements of medical device manufacturing.

Aerospace, Defence, and Energy

Film cooling hole drilling in nickel superalloy turbine blades and combustor liners using the GL.trepan trepanning module for high wall quality and controlled taper at defined angles — maintained through simultaneous B/C axis tilting with the GL.rotil-enabled 5-axis motion system; micro-nozzle machining for propulsion and attitude control fluid delivery; sensor housing machining for high-vibration aerospace environments in titanium and Inconel alloys; and precise trimming of lightweight CFRP and GFRP composite structural components without delamination or fibre pull-out at cut edges. The GL.smart’s 5-axis simultaneous motion is directly applicable to turbine blade cooling hole drilling — the B/C rotary axes maintain correct incidence angle relative to the curved aerofoil surface throughout each drilling cycle, ensuring consistent cooling hole geometry across the full blade surface.

Semiconductors and Microelectronics

Wafer scribing and dicing of brittle semiconductor materials including silicon, GaN, and sapphire substrates using USP cold ablation for minimal HAZ and subsurface damage; MEMS component shaping with high edge resolution for actuator gap definition and resonator mass trimming; microcircuit routing in hybrid electronic packages and ceramic PCBs; and micro-via and through-hole drilling in stacked multilayer packages. Sapphire substrate dicing — used for LED chip singulation and optical window fabrication — is a particularly relevant application for the GL.smart in India’s growing LED manufacturing sector, where the combination of USP cold ablation (minimal chipping at die edges), trepanning (minimum kerf width for maximum die yield), and high cutting speed makes the GL.smart the preferred dicing platform for sapphire and other brittle optical substrates.

Precision Engineering and Watchmaking

Fine dial engraving and micron-level hole array drilling in precious metals, ceramic, and sapphire watch components using the GL.beam and GL.trepan modules; turning of miniature watch shafts, pinions, and axles using the GL.rotil rotary laser turning module — achieving the surface finish and dimensional tolerances of precision mechanical turning without mechanical contact forces that would deform sub-millimetre diameter components; cutting of intricate frames and spring components in titanium and stainless steel; and personalised engraving on luxury timepieces using the GL.scan galvo scanning module for rapid high-resolution pattern execution. Watch gear and escapement component laser turning on the GL.rotil module enables the production of sub-millimetre diameter cylindrical components at the dimensional tolerances required by Swiss watchmaking standards — combining the surface quality of precision turning with the zero-mechanical-force contact of laser processing to eliminate the deflection and vibration that limit mechanical micro-turning quality at these diameters.

United Spectrum Instruments is the official distributor in India for GFH GmbH, delivering end-to-end support for the GL.smart system to ensure maximum performance, reliability, and long-term value. From initial consultation through ongoing service, our team aligns the GL.smart’s hardware modules and process configuration with your specific application requirements and production goals.

Official GFH GmbH Distributor with End-to-End GL.smart Application Support

As the official GFH GmbH distributor in India, United Spectrum Instruments provides the complete service scope for the GL.smart — from pre-sales application feasibility assessment and hardware module selection through turnkey installation and calibration, process recipe development for each of the three machining modes, operator training, and long-term AMC support. Our understanding of the GL.smart’s five hardware modules and their specific application domains — GL.trepan for precision drilling, GL.rotil for laser turning, GL.scan for surface texturing — enables us to configure the system correctly for each customer’s application mix and provide process development support that delivers production-qualified results.

  • Expert Pre-Sales Consultation — we assess your application requirements across drilling, turning, and cutting, recommend the hardware module configuration that addresses your complete process mix, and can arrange sample processing demonstrations before purchase commitment.
  • Seamless Installation and Commissioning — full on-site installation at your facility including machine positioning, granite base levelling, hardware module fitting and alignment, laser source integration, 5-axis calibration to specification, and Industry 4.0 connectivity commissioning.
  • Nationwide Technical Support — India-wide annual maintenance contracts covering preventive maintenance, hardware module inspection and calibration, laser source performance monitoring, and emergency on-site technical support with response time commitments.
  • Spare Parts and Software Updates — United Spectrum Instruments maintains local spare parts inventory for the GL.smart hardware modules, coordinating with GFH GmbH for supply chain reliability, and manages software version updates to ensure the GL.smart benefits from the latest GFH GmbH process control and diagnostics improvements.

FAQs

The GL.smart is an all-in-one compact femtosecond and picosecond laser micro milling system from GFH GmbH that integrates laser drilling, laser turning, and laser cutting in a single platform with five named hardware modules — GL.beam, GL.trepan, GL.optifix, GL.scan, and GL.rotil. What distinguishes it from the GL.compact and Multi-Axis Platform in the same GFH range is its combination of three process types (including laser turning via GL.rotil), five modular beam delivery options, Industry 4.0 connectivity, up to 100 mm workpiece capacity, and Class 1000 cleanroom readiness — making it the most process-versatile and automation-ready platform in the GFH range for manufacturers who need to perform multiple laser micromachining processes in one smart manufacturing environment. Available in India through United Spectrum Instruments.

The GL.smart can produce features as small as 10 µm, depending on the material and laser parameters. Its USP (femtosecond and picosecond) lasers allow sub-surface and multi-layered structuring with high repeatability. The 10 µm minimum feature size is achieved using USP laser sources — femtosecond lasers at UV or near-UV wavelengths with tight focusing optics achieve the finest features through the combination of the smallest diffraction-limited focal spot and cold ablation confined within the high-fluence beam centre. Contact United Spectrum Instruments for material-specific minimum feature size assessment: sales@unitedspectrum.in.

GL.beam provides a fixed beam path for maximum stability — used for precision marking, glass cutting, and controlled surface modification applications requiring maximum pointing consistency. GL.trepan provides trepanning optics for circular and helical beam motion — used for high-quality hole drilling with programmable hole diameter, improved wall quality, and taper control compared to percussion drilling. GL.optifix provides versatile fixed optics for stable focal positioning across flat and slightly contoured surfaces — used for scanning applications requiring fixed optical reference geometry. GL.scan integrates galvanometer-based scanning mirrors for rapid beam deflection — used for fast large-area marking, surface texturing, and high-resolution structuring where stage-based processing would be too slow. GL.rotil adds a rotary axis with synchronised motion control — used for laser turning of cylindrical micro-components, enabling non-contact subtractive machining of miniature shafts, needles, and rotationally symmetric parts.

 

The GL.smart processes metals including stainless steel, titanium, aluminium, Inconel, and precious metals; non-metals including ceramics, polymers, sapphire, glass, and silicon wafers; and composite substrates including CFRP, GFRP, and metal-matrix composites. USP cold ablation provides the mechanism for processing all of these material classes — with wavelength and pulse duration selected to match the absorption and thermal properties of each material. Contact United Spectrum Instruments to confirm compatibility for your specific material: sales@unitedspectrum.in.

Yes. With 5-axis simultaneous interpolation including B and C rotary axes, the GL.smart can process complex 3D geometries, cylindrical components, and curved surfaces with uniform laser impact. B-axis tilt enables angled drilling and cutting on surfaces with defined orientation relative to the horizontal. C-axis rotation combined with X-Z linear traverse enables laser turning of cylindrical profiles. Simultaneous B, C, and X/Y/Z interpolation enables machining on arbitrary 3D surfaces while maintaining surface-normal laser incidence — essential for turbine blade cooling holes, curved housing ports, and complex micro-component geometries.

Yes. The GL.smart is designed for precision prototyping in R&D environments — where multi-process flexibility, application range, and modular hardware adaptation are the priorities — and for continuous industrial manufacturing — where process stability, throughput, Industry 4.0 connectivity, and automated handling support production-rate operation. Process recipes developed during R&D are executed identically in production using the same CNC programmes and hardware module configurations, with robotic handling and automated vision alignment enabling unattended batch production.

Industry 4.0 compatibility on the GL.smart means the system logs process data (laser parameters, stage positions, cycle times, outcomes) per job, provides real-time diagnostics accessible via network, integrates with barcode and vision systems for automated part identification and recipe recall, and supports connectivity with robotic handling and MES platforms for smart manufacturing workflows. This data infrastructure supports statistical process control, predictive maintenance scheduling, and traceability documentation required for ISO 13485, AS9100, and IATF 16949 quality management compliance — without manual data entry.

Laser turning uses a rotating workpiece and a focused laser beam to remove material from the workpiece’s cylindrical surface — the same relative workpiece-tool motion as conventional lathe turning, but the cutting force is optical energy rather than mechanical contact. This eliminates the tool-workpiece contact forces that deflect sub-millimetre diameter workpieces during conventional micro-turning, preventing the bending and runout errors that limit the achievable accuracy and surface finish of mechanical turning at micro-scale diameters. Laser turning on the GL.rotil module achieves cylindrical profile accuracy and surface finish equivalent to precision mechanical micro-turning but without the 10–100 µm diameter threshold below which mechanical turning quality becomes unacceptably poor due to tool contact deflection forces.

GL.trepan moves the focused laser beam in a circular path of programmable diameter while firing — cutting the hole perimeter rather than ablating material from the centre outward as in percussion drilling. This trepanning motion produces holes with better wall circularity, lower taper, better surface finish on the hole walls, and the ability to set hole diameter independently of the laser spot size. At the same focal spot diameter, trepanning can produce holes of any diameter from the minimum spot size upward, while percussion drilling is limited to approximately 1–3× the spot diameter. For high-quality medical device stent holes, aerospace cooling holes, and semiconductor via drilling where taper must be minimised and wall quality must be controlled, the GL.trepan module is the required hardware configuration.

The GL.smart accommodates workpieces up to 100 mm in diameter. This covers the full range from sub-millimetre watch gear and micro-stent workpieces through to 100 mm wafer sections and small precision engineering components. For workpieces up to 100 mm, the full 5-axis motion system and all five hardware modules are available. Contact United Spectrum Instruments to discuss workpiece dimension requirements outside the standard 100 mm diameter capacity:

GET IN TOUCH WITH US

Have a Project in Mind ? Let’s Talk

Tell us about your project or requirements. Our business team will review your inquiry and contact you at the earliest.

FAQs

The GL.smart is an all-in-one compact femtosecond and picosecond laser micro milling system from GFH GmbH that integrates laser drilling, laser turning, and laser cutting in a single platform with five named hardware modules — GL.beam, GL.trepan, GL.optifix, GL.scan, and GL.rotil. What distinguishes it from the GL.compact and Multi-Axis Platform in the same GFH range is its combination of three process types (including laser turning via GL.rotil), five modular beam delivery options, Industry 4.0 connectivity, up to 100 mm workpiece capacity, and Class 1000 cleanroom readiness — making it the most process-versatile and automation-ready platform in the GFH range for manufacturers who need to perform multiple laser micromachining processes in one smart manufacturing environment. Available in India through United Spectrum Instruments.

The GL.smart can produce features as small as 10 µm, depending on the material and laser parameters. Its USP (femtosecond and picosecond) lasers allow sub-surface and multi-layered structuring with high repeatability. The 10 µm minimum feature size is achieved using USP laser sources — femtosecond lasers at UV or near-UV wavelengths with tight focusing optics achieve the finest features through the combination of the smallest diffraction-limited focal spot and cold ablation confined within the high-fluence beam centre. Contact United Spectrum Instruments for material-specific minimum feature size assessment: sales@unitedspectrum.in.

GL.beam provides a fixed beam path for maximum stability — used for precision marking, glass cutting, and controlled surface modification applications requiring maximum pointing consistency. GL.trepan provides trepanning optics for circular and helical beam motion — used for high-quality hole drilling with programmable hole diameter, improved wall quality, and taper control compared to percussion drilling. GL.optifix provides versatile fixed optics for stable focal positioning across flat and slightly contoured surfaces — used for scanning applications requiring fixed optical reference geometry. GL.scan integrates galvanometer-based scanning mirrors for rapid beam deflection — used for fast large-area marking, surface texturing, and high-resolution structuring where stage-based processing would be too slow. GL.rotil adds a rotary axis with synchronised motion control — used for laser turning of cylindrical micro-components, enabling non-contact subtractive machining of miniature shafts, needles, and rotationally symmetric parts.

 

The GL.smart processes metals including stainless steel, titanium, aluminium, Inconel, and precious metals; non-metals including ceramics, polymers, sapphire, glass, and silicon wafers; and composite substrates including CFRP, GFRP, and metal-matrix composites. USP cold ablation provides the mechanism for processing all of these material classes — with wavelength and pulse duration selected to match the absorption and thermal properties of each material. Contact United Spectrum Instruments to confirm compatibility for your specific material: sales@unitedspectrum.in.

Yes. With 5-axis simultaneous interpolation including B and C rotary axes, the GL.smart can process complex 3D geometries, cylindrical components, and curved surfaces with uniform laser impact. B-axis tilt enables angled drilling and cutting on surfaces with defined orientation relative to the horizontal. C-axis rotation combined with X-Z linear traverse enables laser turning of cylindrical profiles. Simultaneous B, C, and X/Y/Z interpolation enables machining on arbitrary 3D surfaces while maintaining surface-normal laser incidence — essential for turbine blade cooling holes, curved housing ports, and complex micro-component geometries.

Yes. The GL.smart is designed for precision prototyping in R&D environments — where multi-process flexibility, application range, and modular hardware adaptation are the priorities — and for continuous industrial manufacturing — where process stability, throughput, Industry 4.0 connectivity, and automated handling support production-rate operation. Process recipes developed during R&D are executed identically in production using the same CNC programmes and hardware module configurations, with robotic handling and automated vision alignment enabling unattended batch production.

Industry 4.0 compatibility on the GL.smart means the system logs process data (laser parameters, stage positions, cycle times, outcomes) per job, provides real-time diagnostics accessible via network, integrates with barcode and vision systems for automated part identification and recipe recall, and supports connectivity with robotic handling and MES platforms for smart manufacturing workflows. This data infrastructure supports statistical process control, predictive maintenance scheduling, and traceability documentation required for ISO 13485, AS9100, and IATF 16949 quality management compliance — without manual data entry.

Laser turning uses a rotating workpiece and a focused laser beam to remove material from the workpiece’s cylindrical surface — the same relative workpiece-tool motion as conventional lathe turning, but the cutting force is optical energy rather than mechanical contact. This eliminates the tool-workpiece contact forces that deflect sub-millimetre diameter workpieces during conventional micro-turning, preventing the bending and runout errors that limit the achievable accuracy and surface finish of mechanical turning at micro-scale diameters. Laser turning on the GL.rotil module achieves cylindrical profile accuracy and surface finish equivalent to precision mechanical micro-turning but without the 10–100 µm diameter threshold below which mechanical turning quality becomes unacceptably poor due to tool contact deflection forces.

GL.trepan moves the focused laser beam in a circular path of programmable diameter while firing — cutting the hole perimeter rather than ablating material from the centre outward as in percussion drilling. This trepanning motion produces holes with better wall circularity, lower taper, better surface finish on the hole walls, and the ability to set hole diameter independently of the laser spot size. At the same focal spot diameter, trepanning can produce holes of any diameter from the minimum spot size upward, while percussion drilling is limited to approximately 1–3× the spot diameter. For high-quality medical device stent holes, aerospace cooling holes, and semiconductor via drilling where taper must be minimised and wall quality must be controlled, the GL.trepan module is the required hardware configuration.

The GL.smart accommodates workpieces up to 100 mm in diameter. This covers the full range from sub-millimetre watch gear and micro-stent workpieces through to 100 mm wafer sections and small precision engineering components. For workpieces up to 100 mm, the full 5-axis motion system and all five hardware modules are available. Contact United Spectrum Instruments to discuss workpiece dimension requirements outside the standard 100 mm diameter capacity:

WHAT WE OFFER

Reliable Engineering Solutions for Modern Manufacturing

Delivering cutting-edge technologies and precision systems that enhance productivity, quality, and innovation in today’s manufacturing environments.
Icon8

Imaging Cameras & Wavefront Sensors

Imaging Cameras & Wavefront Sensors provide high-precision visual and measurement data for inspection, alignment, and process monitoring in industrial and scientific applications.
Discover More
Icon7

Laser Sources

Industrial and Scientific Laser Sources deliver stable, high-precision laser output for micro-machining, cutting, processing, research, and advanced scientific applications across diverse industrial environments
Discover More
Icon7

Dust & Fume Extractors

A Dust & Fume Extractor removes dust, smoke, and fumes at the source to maintain a clean and safe industrial workspace, ensuring regulatory compliance and operator health
Discover More
Icon6

Industrial Laser Systems

Industrial Laser Systems delivers high-precision, reliable laser performance for marking, cutting, welding, micro-machining, and advanced manufacturing applications across diverse industrial.
Discover More
Icon9

Optical Communication Test & Measurement

Optical Communication Systems integrate optical transmitters, receivers, lasers, and OSA for signal generation, transmission.
Discover More
Icon8

Optical Sensors, IR Emitters & LED's

Optical UV Sensors, IR Emitters and LED's provide precise ultraviolet detection and measurement for monitoring, analysis, safety, and scientific applications across industrial and research environments.
Discover More
Icon6

Opto-Electronic Packaging Systems

Opto-electronic packaging systems enable precise assembly, alignment, and packaging of opto-electronic devices for production.
Discover More